Technology Overview

Bond Technologies provides advanced strain gauge bonding systems that are compatible with products from the late Vernon Rumble at BondTech Corporation. Our bonders quickly and efficiently clamp strain gauges in place to yield thin and uniform glue lines. Our ambient temperature bonders conform to curved surfaces and easily clamp strain gauges in otherwise challenging locations. Our hot bonders with PID controls also heat strain gauge adhesives such as M-Bond 610 or P250 that require elevated temperature to cure. Hot bonders are also used to post cure adhesives for creep free high temperature measurements, and to reduce the cure time of room temperature cure adhesives. Contact us for more information about how to make higher quality strain gauge bonds with less effort.