Bond Technologies controllers are designed specifically for curing strain gauge adhesives at elevated temperature. The programable ramp function allows gradual heating to avoid entrapment of bubbles in the adhesive layer. A soak function maintains a constant temperature ±2°F for the prescribed cure time, then automatically shuts-down the heaters. The controllers include a safeguard to reduce the risk of overheating the bonders if they lose vacuum and detach from the structure. Safeguards are also included for thermocouple signal loss and high temperature excursion.